Shenzhen PCBA Factory Specialized in Single Side Double Sided PCB PCBA Rigid Board Custom Service OEM ODM with Drawing

Shenzhen PCBA Factory Specialized in Single Side Double Sided PCB PCBA Rigid Board Custom Service OEM ODM with Drawing

US$9.90
1-499 Pieces
US$7.00
500-999 Pieces
US$6.00
1,000+ Pieces

Basic Info.

Model NO.
YCTBJ-005
Layers
Multilayer
Base Material
FR-4
Certification
RoHS, ISO
Customized
Customized
Condition
New
Transport Package
Bubble Anti-Static Bag
Specification
Custom
Trademark
YCT
Origin
China
HS Code
8534009000
Production Capacity
100000piece/Year

Product Description

PCBA Custom Case
Custom Production Capacity PCB custom capacity
Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L-18L, HDI 20-28 , HDI
Material CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina)
PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

PCBA custom Capacity

Stencil Size
 736x736mm
Minimum IC Pitch 0.2mm
Maximum PCB size 510X460mm
Minimum PCB thickness 0.5mm
Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74x74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Machine Type Panasonic CM 402
Panasonic DT301
Panasonic CM 402 patch speed:0.06sec/ chip (up to 60,000cph)
Patch precision:±0.03~±0.005mm
PCB size:max:510X460mm,min:50X50mm
element size: 0603mm-50X50mm
Panasonic DT301 patch speed:0.7sec/ chip
Patch precision:±0.03~±0.005mm
PCB size:max:510X460mm,min:50X50mm
element size: 1005mm-100X90mmX25mm high speed multifunctional mounter
Volume: One piece to low volume production quantities
Low cost first prototype Fab
Fast deliveries
Assembly type: SMT assembly
DIP assembly
Mixed(surface mount and through hole) technology
Cable assembly
Components type: Passive components
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch
Component source Shar,poshiba, ST,
Samsung, Infineon, Ti,
ON,Microchip etc.
Parts procurements: provide one-stop services
Only Assembly service (you supply the parts)
You supply some parts(expensive/important components), we do the rest
Solder type: Leaded
Lead-free/ROHS compliant
Other capabilities: Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.
Testing Type First prototype test before mass quantity production
AOI
BGA X-ray
PCB E-test
Lead time According Digikey components delivery time

Packaging
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.
Contact
Please click the following to send us message, thank you!
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