5MW 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip

Product Description

5mw 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip Key Features
850nm single wavelength
Low wavelength drift
Oxide isolation technology
Low threshold current
Small emission area
Easy to collimate

Applications
3D sensors
Lidars
IR illuminations
Medical applications
Proximity sensors
Industrial application

5mw 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip Packaging Suggestion
For packaging, the user should use high thermal conductive substrate with AlN or copper; the user also attaches die onto the substrate using high thermal conductive materials such as nanosilver gel or AuSn. The user should have the equipments such as die attachment, wire bonder etc., which should be located in 1000 class clean room. For further assistance in need, please feel free to contact us! We would work with you to solve your issues.
Specification
Item No.: VC850G10

Electrical Optical Characteristics	Typ.
Threshold Current	1.3mA
Forward Voltage	2.0V
Differential Resistance	75Ohms
Slope Efficiency	1W/A
Output Power	6mW
Power Conversion Efficiency	41%
Wavelength	850nm
Divergence Angle	20Deg
Size
Die Size	170umx170um
Die Thickness	130um
Number of Emitters	1
Bond Pad Size(Anode Pad)	90um
Back Electrode Size(Cathode Pad)	170umx170um

Dimension About us Hangzhou Brandnew Technology Co., Ltd.
Founded in 2011, BrandNew, the laser diode company, manufactures high-power diode lasers and systems in a wide range of output powers and wavelengths including fiber-coupled, stack bar lasers and plug and play lasers.
Cooperated with Institute of semiconductors Chinese academy of sciences and Zhejiang University, Today, over 60 technicians and 2 scientists, 20 technicians are with PHD degree. Production space is 10000 Class Lab Clean Room with 2000 square meters. Turnover per year is more than 10M US dollars.
BrandNew's strengths are in talent employees, quality engineering,Process control, product development and volume manufacturing.
Core Competency
Diode Packaging Beam Shaping
Reliability Testing Efficient Cooling
FAQ Can you provide technology supports?
Yes, we have a professional technology supporting team for your timely services.
What about the delivery?
We can offer the door to door services by air, just depend on your actual request. Such as DHL, UPS, TNT, FEDEX
What is the lead time?
Normally 3-5 days. Customized products need 15 working days.
Do you have any MOQ limit?
Low MOQ, 1pc for sample checking is available

What is your terms of payment?
T/T or Western Union, for your choice.
Do you offer guarantee for the products?
Yes, all products have been tested before shipping out.
Lifelong technique support. One year warranty.