Silicon Wafer High Precision Grinding and Polishing Machine

Product Description

Description
Major in pricise lapping ceramic chip, sapphire pieces, silicon slice etc hard material.
Products Show
KD24QXL4 PRECISION GRINDING AND POLISHING MACHINE
Usage: Major in pricise lapping ceramic chip, sapphire pieces, silicon slice etc hard material
Features:
1.The servo fix plate system, to ensure sufficient flatness of mill;
2.Mill on-line monitoring temperature system to prevent distortion and take off flick;
3.Multiple segments or flexible pressurize system, can satisfy the demands of complex processing technology;
4.KIZI original high wear-resisting cast copper mill, greatly improve the efficiency and reduce the cost;
5.Digital charging system, reducing the grinding fluid loss;
6.Rapid positioning device, improve the production efficiency;
7.Four location independent variable speed control system.
Our Service
1. Factory with competative price,high quality and stability
2. R&D Dep. with 20 technicians, 5 of them in decades experience
3. Free charge of customer sample making
4. Completed After sales service and expertise support from Taiwan
Our Company
Workshop & Lab
Company Activity
Patent
Packing & Delivery
Packing Details : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity
FAQ Q: Are you trading company or manufacturer ?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.