Copper Nickel CuNi 2/NC005/Electric Alloy Material Resistance Heating Wire

Product Description

CuNi 2/NC005/Electric Alloy Material Resistance Heating Wire
Copper Nickel 2 s a copper nickel alloy with the addition of Manganese to produce an alloy with a relatively low resistivity but high resistance to oxidation and chemical corrosion. Maximum working temperature is 500 °C. Applications include heating cords and mats
III Main Advantage and Application
A. Physical parameter:
1) Wire diameter: 0.025 ~ 15mm
2) Pure nickel has the ability to withstand relatively high temperatures without deterioration. Maximum operating temperature is approximate 600°C
3) Nickel wire is available in single strand or multi-strand construction. It is supplied from stock either bare, or insulated
B. Characteristics:
1) Excellent straightness
2) Uniform and beautiful surface condition without spots
3) Excellent coil-forming ability

C. Main applications and general purpose:
1) This wire can also be widely used in generally specified for transistor caps, anodes for electronic tubes, leads of electronic components / lead-in-wires for lamps and for wire-mesh. Also used in strip form for various applications including Ni-Cd batteries
2) Also used for cables, Lead-in-Wire for lamps, electronic tube supports, wire cloth electrical connecting leads where temperatures are in excess of those for which copper is suitable, wire weaving
3) Typical applications include: terminations for heating elements as in ovens, plastics extruders, furnaces. Filament supports and lead wires in the lighting industry
NC005 electric alloy material resistance heating wire
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Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy
Properties\Grade		CuNi1	CuNi2	CuNi6	CuNi8	CuMn3	CuNi10
Main Chemical Composition	Ni	1	2	6	8	_	10
	Mn	_	_	_	_	3	_
	Cu	Bal	Bal	Bal	Bal	Bal	Bal
Max Continuous Service Temperature(ºC)		200	200	200	250	200	250
Resisivity at 20ºC (Ω*mm²/m)		0.03	0.05	0.1	0.12	0.12	0.15
Density(g/cm³)		8.9	8.9	8.9	8.9	8.8	8.9
Thermal Conductivity(α×10-6ºC)		<100	<120	<60	<57	<38	<50
Tensile Strength(Mpa)		≥210	≥220	≥250	≥270	≥290	≥290
EMF vs Cu(μVºC)(0~1000ºC)		-8	-12	-12	-22	_	-25
Approximate Melting Point(ºC)		1085	1090	1095	1097	1050	1100
Micrographic Structure		austenite	austenite	austenite	austenite	austenite	austenite
Magnetic Property		non	non	non	non	non	non
Properties\Grade		CuNi14	CuNi19	CuNi23	CuNi30	CuNi34	CuNi44
Main Chemical Composition	Ni	14	19	23	30	34	44
	Mn	0.3	0.5	0.5	1	1	1
	Cu	Bal	Bal	Bal	Bal	Bal	Bal
Max Continuous Service TemperatureºC)		300	300	300	350	350	400
Resisivity at 20ºC (Ω*mm²/m)		0.2	0.25	0.3	0.35	0.4	0.49
Density(g/cm³)		8.9	8.9	8.9	8.9	8.9	8.9
Thermal Conductivity(α×10-6ºC)		<30	<25	<16	<10	<0	<-6
Tensile Strength(Mpa)		≥310	≥340	≥350	≥400	≥400	≥420
EMF vs Cu(μVºC)(0~1000ºC)		-28	-32	-34	-37	-39	-43
Approximate Melting Point(ºC)		1115	1135	1150	1170	1180	1280
Micrographic Structure		austenite	austenite	austenite	austenite	austenite	austenite
Magnetic Property		non	non	non	non	non	non