High Density Disc Electroplating Tooling for Lead Frame

Product Description

Product Description
High Density Disc Electroplating Tooling for Lead Frame
Tooling size: Ø260*(60-130),Ø480*(60-130)
Delivery Time: Normal processing cycle is 7-10days
Tooling accuracy: ≥ ±0.1mm
It is developed for the requirements of selective silver plating of multi-row and multi-unit lead frames, and solves the problem about the diffrence of thickness is too big between the middle part and the edge part of the wide lead frame.

ADVANTAGE
Products can be customized according to the situation of different dimension of drum diameter.
High precision of product plating area.
High electroplating efficiency.
Using PEEK material, acid, alkali resistance and high temperature resistance.

Certifications
Our Customers
Company Profile
FAQ
FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.
Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.
Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.
Q:What is the packaging of the equipment like? What is the delivery method?
A:Standard export fumigation sign wooden box packing or delivery by land or sea.
Q:how to install and debug the equipment after its arrival ?
A:After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.