Glasses Watch and Clock Industry Professional Fiber Laser Marking Machine

Product Description

Product Description
Features:
1. Utilizes the world's largest source of Fiber lasers-IPG Photonics. 2. Adopts the newest generation of laser marking control. 3. Integrates the encoder data port which can get the assembly line speed real time that is for flying marking application. 4. Adopts one key starting with a simple interface. 5. The appearance is compact with a simplified air cooling system. Was developed according to CE and FDA/CDRH standard, meeting the strictest safety requirements.
Brief Description
1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon. 2. Suitable for various industries: Electronic components industry Medical device industry Glasses, watch and clock industry IC card industry Jewelry industry
Specification:

Model	MARS-10J	MARS-20J
Laser output power	10W	20W
Wavelength	1064nm	1064nm
Beam quality M2	<1.6	<1.6
Laser repetition frequency	20-80KHz	20-80KHz
Marking scope	100mm*100mm(standard) 150mm*150mm(optional) 300mm*300mm(optional)	100mm*100mm(standard) 150mm*150mm(optional) 300mm*300mm(optional)
Marking speed	≤7000mm/s	≤7000mm/s
Min. line width	0.012mm	0.012mm
Min. character size	0.15mm	0.15mm
Repetition precision	±0.003mm	±0.003mm
Cooling	Air cooling, fan/filter (no water cooling required)	Air cooling, fan/filter (no water cooling required)
Input power	110~230VAC, 50/60 HZ	110~230VAC, 50/60 HZ
Power consumption	<500W	<500W
Expected MTTF (Diode)	Greater than 100,000 hours	Greater than 100,000 hours

Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping

FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.