| US$46,000.00-230,000.00 | 1 Piece (MOQ) |
| Process Type | Sort by Process Material | Sort by Application | |
| Substrate thinning | Metals and Alloys Industrial Ceramics Oxidizing substances Carbide Glass plastic | Semi Conductor | Wafer substrate Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc. |
| Resin | PE,E/VAC,SBS,SBR,NBR,SR,BR,PR | ||
| PCB | Adhesive, coating, circuit | ||
| Optical | Optical lenses, optical reflectors, scintillation crystals, holographic projection glass, HUD glass, screen glass, | ||
| Radar | oxide skin | ||
| Regular Specification | |
| Machine Series | MDFD250HG |
| Work Table Diameter | Φ250 mm / 10 inches |
| Maximum Grinding Diameter | Φ250 mm |
| Minimum Grinding Thickness | T≥35μm (12" with carrier) |
| Grinding Roughness | Ra≤0.02μm (with abrasive of grains grits 2000) |
| Feeding Resolution | RES = 0.1 μm |
| Grinding Feeding Speed | 0.1 ~ 10μm/sec (grinding feeding speed) |
| Fast Feeding Speed | 0.01 ~ 1mm/sec (from origin point to pre-feeding position) |
| No. of Worktable | 1 |
| Wheel Rotate Speed | 0-3000 rpm |
| Worktable Rotate Speed | 0-300 rpm |
| Upper Spindle Power | Electric Spindle 5.5kW |
| Lower Spindle Power | Electric Spindle 2.2kW |
| Coolant Tank Volume | 75L |
| Pulse Hand Wheel Resolution | 1×, 10×, 100× |
| Pneumatic Source | 0.6-0.8MPa |
| Total Weight | 1200 kg |
| Dimension | 1150×1200×2000 mm |
| Optional Choice | Specification |
Non-Contact (Infrared) Thickness Gauge | Brand: Marposs Resolution:0.1μm Measurement Precision: ≤0.5μm |
Contact Thickness Gauge | Brand: Marposs Resolution:0.1μm Measurement Precision: ≤0.5μm |
| (Upper Spindle) Aerostatic Graphite Electric Spindle | Power: 5.5kW Spindle Balance:0.05μm(3000rpm) |
Grinding Wheel | Grains Grits Size: 320 to 6000 Abrasive Material: |