Plate Tube Optical Fiber Laser Cutting Equipment for Laser Cutting of Metal Pipes/Plates

Plate Tube Optical Fiber Laser Cutting Equipment for Laser Cutting of Metal Pipes/Plates

US$100,000.00-1,000,000.00 1 Piece (MOQ)

Basic Info.

Laser Classification
Semiconductor Laser
Product Name
Plate Tube Optical Fiber Laser Cutting Machine
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
MPS-DT is one of the flagship products, mainly used for cutting thin metal plates and laser cutting of metal pipes such as round, square, rectangular, and elliptical pipes made of ordinary carbon steel and stainless steel materials; Open structure, superior performance, stability, and extremely high cost-effectiveness.
Product features:1. It is formed by welding profiles, and then processed by heat treatment annealing. The excellent heat treatment process ensures the overall rigidity of the machine tool and the stability of long-term use.2. The front and rear of the pipe cutting section adopt a pair of linked self centering chucks, with pneumatic automatic clamping working mode.3. The entire machine adopts high-quality servo motors and a high-precision forming machine with a dual drive gear rack transmission structure, resulting in high precision and processing efficiency.4. The equipment is stable, with a user-friendly operation interface and real-time feedback on the processing status, ensuring the orderly progress of cutting and processing.


Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping

FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.

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