CX120A Diamond Wire Sawing Machine for Optical Glass

Product Description

Product Description
CX120A Multi-wire Saw
CX120A Multi-wire Saw is mainly applied to straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. The unique design can achieve the replacement of internal circle cutter.
Product Features
>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Stable Frame
The whole casting structure has high damping coefficient and excellent vibration damping performance.
>Optimized Location System
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.
>Flexible Cutting
The left and right slide table on the workbench can be independently moved back and forth, and the left and right sides can cut products of different thicknesses.
>Flexible Wire Winding
Achieve the cutting of products within 170mm through switching wire winding mode.
>Convenient Wire Winding
The wire pay-off spool adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.
>Wire break memory system.
Cut Samples

Product Parameters

Detail	Parameter
Model	CX120A
Maximum work size	160×690mm(Double workbench)
Material plate qty	4
Workbench qty	2
Wire winding space	85/170mm
Wire winding workbench qty	16/14
Roller out diameter *Workable width	(φ130±10mm)x15x3rollers
Wire diameter	φ0.12mm-φ0.25mm
Wire spool storage	40km(φ0.25mm)
Maximum running speed	Max 1000m/min
Travel of table lifting	220mm
Travel of table translation	200mm
Cutting method	Vertically upward movement
Wire feed speed	0.1~99.9mm/min
Cutting Fluid	Water-based cutting fluid or cutting oil
Fluid Storage	800L
Fluid Flow rate	200*2L/min
Power supply	Three-phase 380V 50Hz
Power	26Kw
Air supply	Adopting water-based cutting fluid, the air pressure is more than 0.4MPa.
Size L*W*H	4000mm*1900mm*2600mm
Weight	8500Kg

About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.