Diamond Single-Wire Sawing Machine for Large Size Sapphire Silicon Cutting Tool

Diamond Single-Wire Sawing Machine for Large Size Sapphire Silicon Cutting Tool

US$48,000.00-200,000.00 1 set (MOQ)

Basic Info.

Model NO.
DCX1000
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
1000X1000X1000mm
Maximum Running Speed
1200m/Min
Test Cut
Provide Test Cut Service
Dimension
3470X3500X3200mm
Weight
12000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description
DCX800 Single-wire Saw
DCX800 Single-wire Saw uses single diamond wire to cut super hard and brittle materials such as large size Sapphire, Quartz Crystal, Optical Glass, Jade, etc. With swing cutting function, through the diamond wire swing thus reduce the product cutting area and achieve the cutting of super hard and brittle materials.
Product Features
>Stable Frame
The machine body is whole-casted, which makes high speed running stable and reliable.
>Flexible Cutting
Horizontal displacement worktable makes cutting flexible and efficient.
>High Efficiency
Set swing cutting function for diamond wire for high efficiency.
>Cut Large Size Materials
Suitable for cutting large size workpiece, the maximum cutting size is up to 800x800x800mm.
>Wire break memory system.
Cut Samples

Product Parameters
DetailParameter
ModelDCX1000
Maximum work size1000mm*1000mm*1000mm
Number of workbench1
Storage40Km
Running SpeedMax1200m/min
Wire diamondφ0.25mm~φ0.6mm
Cutting methodDiamond wire feeds parallel or swinging downwards
Workbench swing angle±30°
Cutting fluidWater-based cutting fluid or cutting oil
Fluid storage355L
Fluid flow rate180L/min
PowerThree-phase 380V 50Hz
Full-load Power25kw
Size L*W*H3470mm*3500mm*3200mm
Weight12000Kg
About Us
FAQ
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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