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Communication equipment PCB Board | Electronic products PCB Board | ||||
Industrial control PCB Board | Automotive PCB Board | Aerospace PCB Board | |||
Single-Sided PcB Board | Double-Sided PCB Board | PCB 4-Layer Board | |||
PCB 6-Layer Board | PCB 8-Layer Board | PCB 10-Layer Board | |||
Multi-Layer PCB Board Maximum 24L | Copper PCB Board | Ceramic PCB Board | |||
Rigid-Flex PCB Board | Rigid PCB Board | Flexible PCB Board | |||
PCB High Frequency HighSpeed Board | Aluminum PCB Board | PCBA SMT |
Design Features | 2024 | Special process design |
Number of floors (maximum) | 24L | 1.Embedding copper ingot 2.Grading goldfinger 3.High frequency high speed material mixed pressing 4.Control deep drilling and back drilling |
Maximum plate thickness | 6.0mm | |
Minimum plate thickness | 0.25mm | |
Inner layer copper thickness | 1/3~4oz | |
Outer copper thickness | 1/3 ~6oz | |
Minimum Through Hole | 0.15mm | |
Min. blind hole (laser drilled) | 0.05mm | |
Minimum buried holes | 0.1mm | |
Through-hole plating aspect ratio capability | 16:1 | |
Plated filled hole aspect ratio capability | 1:1 | |
Minimum line width/spacing of inner layer | 50/50μm | |
Minimum line width/line spacing for outer layer | 50/50μm | |
Minimum BGA PAD | 0.2mm | |
Minimum BGA pitch (centre) | 0.40mm | |
Impedance control accuracy | ±10% | |
Plated hole filling Dimple≤ | 10um | |
Maximum Patchwork Size (Mass Production) | 610mm*720mm | |
Surface Finish | Immersion Gold / Immersion Tin / Immersion Silver / Gold Plating / Lead Free Tin Spraying / OSP / Immersion Gold + OSP | |
Soldermask Colour | Solder resist silkscreen: green, matte green, red, yellow, blue, black (matte black, glossy black), white Low pressure spraying: green |
Material class | Key parameter | Material type Brand supplier Panasonic/Rogers/Shengyi/Guoneng/Ruilong/Zhongying/Lianmao/Taiguang/South Asia/Ultrasound/Taiyao |
PTFE Series | - | R03003 AD300C Taconic RF30-7H RF-35 SG3300/GF300/GF255/SG7350D/SG7350D2 /mmWave77 GNC3304/GN300BP ZYF300CA ZYF220D RA300 RNP280 RP220 |
PPO Series | - | AeroWave300/mmWaveG |
Hydrocarbon Series | - | RO4730 RO4003C RO4350 RO4534 RO4535 ZYC8300 RT350B LNB33 /LNB33C/ S7136H /S7136D IT998/E EM892K/K2 |
Extremely low loss | DF<0.002 | (M8N)R-5795N TU943N/R Synamic9GN/GN2 |
Ultra Low Loss | 0.004≤ DF<0.002 | (M7N)R-5785N/GN Synamic8GN /Synamic8G /Synamic6N EM890K EM891K TU933+ TU883ASP IT988GSE |
Ver y Low Loss | 0.006≤DF<0.004 | (M6)R-5775/G/N Synamic6/GX IT968/G /SE IT988G EM528/K EM890 EM891 TU883/C/A TU885 |
Low loss | 0.009≤DF<0.006 | (M4)R-5725/S S7439 S7439G S7439C SDI06K IT150DA IT170GRA2 IT958G EM526 EM888/S EM888K TU872LK TU872SLK TU863+ TU872SLKSP |
Mid loss | 0.018≤DF< 0.009 | (M2)R-1577 EM828G EM370(D) EM390 TU862HF TU865 S7040G S7045G SML02G(X) IT150GS IT170GRA1 IT170GT |
FR4 | CAF | S1150G S1000H Autolad1 S1000-2M Autolad2G Autolad3 Autolad1G Autolad3G IT150G IT158 IT180A IT180I NP155F NP175F NPG151 GW1500 GW1700-1 GW2000-1 GW3000A |
Design Features | 2024 | 2024 |
Material specification | FCCL 12-50um (Electrolysis/calendering) | - |
Covering film 12-50um (Yellow/Black) | - | |
Low-flow glue PP 40-100um | - | |
RF layer number | Number of floors | 10L |
Total plate thickness | Thickness | 0.25-2.0mm |
Copper thickness | Inner & Outer layers | 1/4-2OZ |
Surface treatment | Processing mode | - |
Line width/line distance (minimum) | Face copper thickness =36 | 70/70μm |
Aperture /Pad(min) | Mechanical drilling PTH | 100μm/300μm |
Laser drilling Via | 50μm/200um | |
impedance | Impedance specification | 10% |
Solder resist | Alignment tolerance (CCD/DI) | 50um/20um |
Soft and hard board interface area | Overflow specification | 0.5mm |
Steel sheet/reinforcement | Fitting tolerance | 150um |
W/B zone | Flatness (front/back) | 20um/30um |
Appearance | Forming tolerance | 150um |