Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh

Product Description

Product description: Horizontal back grinder MDYM-230WH MDYM-300WH Application:
suitable for high hardness,thin,and high precision product. like LED sapphire substrate,quartz crystal,silicon wafer,ceramic,wolfram plate, germanium plate thinning(grinding)
Principle:
This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.
This machine can auto aiming the tool, actually test the grinding torque,automatic adjust the grinding speed, so to avoid broking the wafer.
1,Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.
2,High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.
Specification:

Model	YM-150WH	YM-180WH	YM-200WH	YM-230WH	YM-300WH
Grinding wheel	D150*h25mm	D180*h25mm	D200*h30mm	D230*h30mm	D300*h30mm
Max material size	D150mm	D180mm	D200mm	D230mm	D300mm
Material spindle speed(adjustable)	0-1000rpm	0-1000rpm	0-800rpm	0-800rpm	0-800rpm
Grinding wheel speed(adjustable)	0-2000rpm	0-2000rpm	0-1800 rpm	0-1800 rpm	0-1800 rpm
Grinding wheel motor power	1.5kw/3*380V	1.5kw/3*380V	2.2kw/3*380V	2.2kw/3*380V	2.2kw/3*380V
Material spindle motor power	0.75kw/3*380V	0.75kw/3*380V	0.75kw/3*380V	0.75kw/3*380V	1.1kw/3*380V
Parallelism	1um(for D100mm)	1um(for D100mm)	1um(for D100mm)	1um(for D100mm)	1um(for D100mm)
Dimension(mm)	1200*550*1550	1200*550*1550	1350*600*1600	1350*600*1600	1500*700*1650
Weight	760kg	850kg	960kg	1000kg	1100kg

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