Flying Speed Interactive Optical Fiber Laser Cutting Machine with Strong Cutting Ability

Product Description

Product Description
The MPS-H series of products is the preferred model in the metal material processing industry, with strong cutting ability, flying cutting speed, extremely low operating costs, excellent stability, high-quality processing, and strong adaptability. The parallel interactive workbench, with an enclosed sheet metal outer protective structure, is a laser cutting product with superior performance and extremely high cost-effectiveness. Mainly used for cutting various metal flat plates.
Product features:1. This product adopts a gantry dual drive structure, with the bed as an integral welded component and the crossbeam as an aviation cast aluminum component. Both are rough machined after annealing, and then subjected to secondary vibration aging treatment before overall precision machining, achieving extremely high form and positional tolerance accuracy.2. The equipment is stable and adopts a motion control system. After 20 years of mature use and continuous improvement in the field of laser cutting, the system has high performance, high reliability, and a user-friendly operation interface, ensuring humanized and convenient operation, and orderly cutting and processing.3. The entire machine adopts a servo motor dual drive precision reducer and a gear rack structure, ensuring the high-speed and efficient operation of the equipment, as well as better accuracy and stability.4. Advanced gas path control system design, equipped with imported pneumatic components, allows customers to freely use high and low pressure cutting auxiliary gases according to their needs, ensuring cutting quality while effectively reducing usage costs.

Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping

FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.